Please use this identifier to cite or link to this item: https://doi.org/10.1109/APMC.2005.1606378
DC FieldValue
dc.titlePEEC model for multiconductor systems including dielectric mesh
dc.contributor.authorJayabalan, J.
dc.contributor.authorOoi, B.L.
dc.contributor.authorIrene, A.
dc.contributor.authorLeong, M.S.
dc.contributor.authorIyer, M.K.
dc.date.accessioned2014-06-19T03:23:06Z
dc.date.available2014-06-19T03:23:06Z
dc.date.issued2005
dc.identifier.citationJayabalan, J.,Ooi, B.L.,Irene, A.,Leong, M.S.,Iyer, M.K. (2005). PEEC model for multiconductor systems including dielectric mesh. Asia-Pacific Microwave Conference Proceedings, APMC 2 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/APMC.2005.1606378" target="_blank">https://doi.org/10.1109/APMC.2005.1606378</a>
dc.identifier.isbn078039433X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/71381
dc.description.abstractIn this paper, an elastomer dielectric mesh with and without metallization is modeled by the partial element equivalent circuit (PEEC) method. The model is verified through frequency domain measurements on a coplanar transmission structure sample. Due to good electrical contactability and mechanical compliance, this material has novel applications for fine pitch wafer level device testing at multi-gigahertz frequencies. © 2005 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/APMC.2005.1606378
dc.sourceScopus
dc.subjectDielectric mesh
dc.subjectPEEC
dc.subjectWafer level package test
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/APMC.2005.1606378
dc.description.sourcetitleAsia-Pacific Microwave Conference Proceedings, APMC
dc.description.volume2
dc.description.page-
dc.identifier.isiutNOT_IN_WOS
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