Please use this identifier to cite or link to this item:
https://doi.org/10.1109/VLSIT.2010.5556240
DC Field | Value | |
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dc.title | III-V MOSFETs with a new self-aligned contact | |
dc.contributor.author | Zhang, X. | |
dc.contributor.author | Guo, H. | |
dc.contributor.author | Ko, C.-H. | |
dc.contributor.author | Wann, C.H. | |
dc.contributor.author | Cheng, C.-C. | |
dc.contributor.author | Lin, H.-Y. | |
dc.contributor.author | Chin, H.-C. | |
dc.contributor.author | Gong, X. | |
dc.contributor.author | Lim, P.S.Y. | |
dc.contributor.author | Luo, G.-L. | |
dc.contributor.author | Chang, C.-Y. | |
dc.contributor.author | Chien, C.-H. | |
dc.contributor.author | Han, Z.-Y. | |
dc.contributor.author | Huang, S.-C. | |
dc.contributor.author | Yeo., Y.-C. | |
dc.date.accessioned | 2014-06-19T03:13:03Z | |
dc.date.available | 2014-06-19T03:13:03Z | |
dc.date.issued | 2010 | |
dc.identifier.citation | Zhang, X.,Guo, H.,Ko, C.-H.,Wann, C.H.,Cheng, C.-C.,Lin, H.-Y.,Chin, H.-C.,Gong, X.,Lim, P.S.Y.,Luo, G.-L.,Chang, C.-Y.,Chien, C.-H.,Han, Z.-Y.,Huang, S.-C.,Yeo., Y.-C. (2010). III-V MOSFETs with a new self-aligned contact. Digest of Technical Papers - Symposium on VLSI Technology : 233-234. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/VLSIT.2010.5556240" target="_blank">https://doi.org/10.1109/VLSIT.2010.5556240</a> | |
dc.identifier.isbn | 9781424476374 | |
dc.identifier.issn | 07431562 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/70519 | |
dc.description.abstract | We report the first demonstration of III-V n-MOSFETs with self-aligned contact technology. The self-aligned contact was formed using a salicide-like process which is compatible with CMOS process flow. A new epitaxy process was developed to selectively form a thin continuous germanium-silicon (GeSi) layer on gallium arsenide (GaAs) source and drain (S/D) regions. Nickel was deposited and annealed to form NiGeSi, and unreacted metal was removed. A second anneal diffuses Ge and Si into GaAs to form heavily n+ doped regions, and a novel self-aligned nickel germanosilicide (NiGeSi) ohmic contact was achieved. MOSFETs with the new self-aligned metallization process were realized. © 2010 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/VLSIT.2010.5556240 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/VLSIT.2010.5556240 | |
dc.description.sourcetitle | Digest of Technical Papers - Symposium on VLSI Technology | |
dc.description.page | 233-234 | |
dc.description.coden | DTPTE | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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