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Title: Wafer location integrity in aluminum metallization
Authors: Ng, T.W. 
Lau, S.H.
Keywords: Position metallization aluminum
Wafer metrology
Issue Date: Aug-2004
Citation: Ng, T.W., Lau, S.H. (2004-08). Wafer location integrity in aluminum metallization. Microelectronic Engineering 75 (2) : 172-176. ScholarBank@NUS Repository.
Abstract: Aluminum sticking between wafer and clamp ring is unavoidable during metallization. The non-concentric location of the wafer on the clamp ring may result in awkward drop-off after sputtering; resulting in damage to the wafer. An existing hoop lift and clamp ring design to locate the wafer during sputtering was deemed not to adequately meet complete constraint requirements in relation to kinematic positioning principles. A prototype model hoop lift and clamp ring design that met these requirements was fabricated. In a verification experiment, an optical planar displacement sensing method was used to ascertain the location integrity of the two designs via a repeated placement test. The prototype model hoop lift and clamp ring design was shown to exhibit significantly improved levels of location integrity compared with the original design. © 2004 Elsevier B.V. All rights reserved.
Source Title: Microelectronic Engineering
ISSN: 01679317
DOI: 10.1016/j.mee.2004.04.002
Appears in Collections:Staff Publications

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