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|Title:||Geometric modelling of IC die bonds for inspection||Authors:||Ngan, K.N.
|Keywords:||IC bond inspection
|Issue Date:||Jul-1989||Citation:||Ngan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository.||Abstract:||This paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. © 1989.||Source Title:||Pattern Recognition Letters||URI:||http://scholarbank.nus.edu.sg/handle/10635/62257||ISSN:||01678655|
|Appears in Collections:||Staff Publications|
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