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https://scholarbank.nus.edu.sg/handle/10635/62257
| Title: | Geometric modelling of IC die bonds for inspection | Authors: | Ngan, K.N. Kang, S.B. |
Keywords: | IC bond inspection machine vision pattern recognition |
Issue Date: | Jul-1989 | Citation: | Ngan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository. | Abstract: | This paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. © 1989. | Source Title: | Pattern Recognition Letters | URI: | http://scholarbank.nus.edu.sg/handle/10635/62257 | ISSN: | 01678655 |
| Appears in Collections: | Staff Publications |
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