Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/62257
Title: Geometric modelling of IC die bonds for inspection
Authors: Ngan, K.N. 
Kang, S.B.
Keywords: IC bond inspection
machine vision
pattern recognition
Issue Date: Jul-1989
Source: Ngan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository.
Abstract: This paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. © 1989.
Source Title: Pattern Recognition Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/62257
ISSN: 01678655
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

33
checked on Dec 15, 2017

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.