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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/62257
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dc.titleGeometric modelling of IC die bonds for inspection
dc.contributor.authorNgan, K.N.
dc.contributor.authorKang, S.B.
dc.date.accessioned2014-06-17T06:49:04Z
dc.date.available2014-06-17T06:49:04Z
dc.date.issued1989-07
dc.identifier.citationNgan, K.N.,Kang, S.B. (1989-07). Geometric modelling of IC die bonds for inspection. Pattern Recognition Letters 10 (1) : 47-52. ScholarBank@NUS Repository.
dc.identifier.issn01678655
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/62257
dc.description.abstractThis paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. © 1989.
dc.sourceScopus
dc.subjectIC bond inspection
dc.subjectmachine vision
dc.subjectpattern recognition
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.sourcetitlePattern Recognition Letters
dc.description.volume10
dc.description.issue1
dc.description.page47-52
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

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