Please use this identifier to cite or link to this item:
|Title:||Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects||Authors:||Balakumar, S.
Cu seed layer
Stress and multi-stack
|Issue Date:||Aug-2004||Citation:||Balakumar, S., Wong, G., Tsang, C.F., Hara, T., Yoo, W.J. (2004-08). Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects. Microelectronic Engineering 75 (2) : 183-193. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2004.05.003||Abstract:||An understanding of adhesion strength at Cu/barrier interface and Cu layer properties at different metal level is necessary to develop a robust planarization (CMP) process without peeling and delamination. This paper quantitatively analyzes the relation between stress and adhesion strength of Cu and its underlying layers of Cu interconnection. The properties of Cu layer on single and dual SiOC dielectric stacks with two different seed layer thickness were systematically studied. Effects of single and dual dielectric stack on stress, adhesion strength and growth orientation of Cu was explored in detail. Strongest adhesion strength between Cu and its underlying layers was found on single dielectric stack of 500 Å Cu seed on Ta barrier. It was reduced significantly after 6 kÅ of Electroplated (ECP) Cu layer was deposited on the stacks of dual dielectric scheme. The adhesion strength/interfacial bonding of dielectrics with Cu was deteriorated by 20% as a result of high stress ECP Cu layer without annealing. In this study, it was found that the properties of conductive Cu layer were strongly influenced by number of dielectric stacks. The results of this study further strengthens our claim that low stress films of dielectric stacks are necessary and essential for enhancing adhesion strength and interfacial bonding between Cu/dielectric layer. Moreover, annealing enhanced the growth of (1 1 1) Cu seed which in turns improved ECP Cu deposition. Better film morphology, improved uniformity of (1 1 1) Cu seed is essential for stress free Cu layer growth. © 2004 Elsevier B.V. All rights reserved.||Source Title:||Microelectronic Engineering||URI:||http://scholarbank.nus.edu.sg/handle/10635/55891||ISSN:||01679317||DOI:||10.1016/j.mee.2004.05.003|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 15, 2019
WEB OF SCIENCETM
checked on Jul 15, 2019
checked on May 24, 2019
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.