Measurement of residual stress using fiber electronic speckle pattern interferometry

Abstract

In this paper, the evolution properties of micro-deformation field in the copper bicrystals with a symmetric tilt boundary are studied with digital speckle metrology. The micro-speckles are successfully made and the SEM speckle photographs under different loading stages are obtained. The deformation field of the copper bicrystals is quantitatively studied for the first time, and the micro-displacement field and strain field are accurately calculated. The experimental results show that, the evolution characteristics of the displacement field is obviously different from that of the macro-displacement field. These results provide some basic experimental data for the study of micromechanics.