Please use this identifier to cite or link to this item: http://scholarbank.nus.edu.sg/handle/10635/50632
Title: Measurement of residual stress using fiber electronic speckle pattern interferometry
Authors: Zhang, Jingbo 
Fok, Wing C.
Chong, Tow C. 
Issue Date: 1997
Source: Zhang, Jingbo,Fok, Wing C.,Chong, Tow C. (1997). Measurement of residual stress using fiber electronic speckle pattern interferometry. Proceedings of SPIE - The International Society for Optical Engineering 2921 : 584-591. ScholarBank@NUS Repository.
Abstract: In this paper, the evolution properties of micro-deformation field in the copper bicrystals with a symmetric tilt boundary are studied with digital speckle metrology. The micro-speckles are successfully made and the SEM speckle photographs under different loading stages are obtained. The deformation field of the copper bicrystals is quantitatively studied for the first time, and the micro-displacement field and strain field are accurately calculated. The experimental results show that, the evolution characteristics of the displacement field is obviously different from that of the macro-displacement field. These results provide some basic experimental data for the study of micromechanics.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/50632
ISBN: 0819423238
ISSN: 0277786X
Appears in Collections:Staff Publications

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