Please use this identifier to cite or link to this item:
https://doi.org/10.1109/icept.2006.359814
| Title: | Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System | Authors: | Yong, Wayne Jin, Cai Xiao Ho, Hong Meng |
Keywords: | illumination model illumination calibration lighting calibration Vision system machine vision |
Issue Date: | Aug-2006 | Publisher: | IEEE | Citation: | Yong, Wayne, Jin, Cai Xiao, Ho, Hong Meng (2006-08). Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System. 2006 7th International Conference on Electronic Packaging Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/icept.2006.359814 | Abstract: | A method has been proposed to model the illumination characteristics of a typical wire bonder vision system. The proposed model can be used to calibrate the illumination of the vision system to ensure the same level of illumination brightness across different machines, given the same lighting level setting. The approach to extract the machine illumination model is semi-empirical and the model provides a closed-form solution. © 2006 IEEE. | Source Title: | 2006 7th International Conference on Electronic Packaging Technology | URI: | https://scholarbank.nus.edu.sg/handle/10635/185903 | ISBN: | 142440620X 9781424406203 |
DOI: | 10.1109/icept.2006.359814 |
| Appears in Collections: | Staff Publications Elements |
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| p0623-113.pdf | 159.09 kB | Adobe PDF | OPEN | Post-print | View/Download |
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