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Please use this identifier to cite or link to this item: https://doi.org/10.1109/icept.2006.359814
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dc.titleIllumination System Modeling Techniques in Wire Bonding Pattern Recognition System
dc.contributor.authorYong, Wayne
dc.contributor.authorJin, Cai Xiao
dc.contributor.authorHo, Hong Meng
dc.date.accessioned2021-01-28T01:12:49Z
dc.date.available2021-01-28T01:12:49Z
dc.date.issued2006-08
dc.identifier.citationYong, Wayne, Jin, Cai Xiao, Ho, Hong Meng (2006-08). Illumination System Modeling Techniques in Wire Bonding Pattern Recognition System. 2006 7th International Conference on Electronic Packaging Technology. ScholarBank@NUS Repository. https://doi.org/10.1109/icept.2006.359814
dc.identifier.isbn142440620X
dc.identifier.isbn9781424406203
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/185903
dc.description.abstractA method has been proposed to model the illumination characteristics of a typical wire bonder vision system. The proposed model can be used to calibrate the illumination of the vision system to ensure the same level of illumination brightness across different machines, given the same lighting level setting. The approach to extract the machine illumination model is semi-empirical and the model provides a closed-form solution. © 2006 IEEE.
dc.publisherIEEE
dc.sourceElements
dc.subjectillumination model
dc.subjectillumination calibration
dc.subjectlighting calibration
dc.subjectVision system
dc.subjectmachine vision
dc.typeConference Paper
dc.date.updated2021-01-27T11:32:48Z
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.description.doi10.1109/icept.2006.359814
dc.description.sourcetitle2006 7th International Conference on Electronic Packaging Technology
dc.published.statePublished
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