Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/158676
Title: A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
Authors: XIONG ZHENGPENG
Issue Date: 2001
Citation: XIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository.
URI: https://scholarbank.nus.edu.sg/handle/10635/158676
Appears in Collections:Master's Theses (Restricted)

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