Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/158676
| Title: | A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES | Authors: | XIONG ZHENGPENG | Issue Date: | 2001 | Citation: | XIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository. | URI: | https://scholarbank.nus.edu.sg/handle/10635/158676 |
| Appears in Collections: | Master's Theses (Restricted) |
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