Please use this identifier to cite or link to this item:
https://scholarbank.nus.edu.sg/handle/10635/158676
| DC Field | Value | |
|---|---|---|
| dc.title | A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES | |
| dc.contributor.author | XIONG ZHENGPENG | |
| dc.date.accessioned | 2019-09-16T02:34:33Z | |
| dc.date.available | 2019-09-16T02:34:33Z | |
| dc.date.issued | 2001 | |
| dc.identifier.citation | XIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository. | |
| dc.identifier.uri | https://scholarbank.nus.edu.sg/handle/10635/158676 | |
| dc.source | CCK BATCHLOAD 20190911 | |
| dc.type | Thesis | |
| dc.contributor.department | MECHANICAL ENGINEERING | |
| dc.contributor.supervisor | ANDREW A.O. TAY | |
| dc.description.degree | Master's | |
| dc.description.degreeconferred | MASTER OF ENGINEERING | |
| Appears in Collections: | Master's Theses (Restricted) | |
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| File | Description | Size | Format | Access Settings | Version | |
|---|---|---|---|---|---|---|
| b22809806.PDF | 5.29 MB | Adobe PDF | RESTRICTED | None | Log In |
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