Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/158676
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dc.titleA NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES
dc.contributor.authorXIONG ZHENGPENG
dc.date.accessioned2019-09-16T02:34:33Z
dc.date.available2019-09-16T02:34:33Z
dc.date.issued2001
dc.identifier.citationXIONG ZHENGPENG (2001). A NUMERICAL STUDY OF FRACTURE IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository.
dc.identifier.urihttps://scholarbank.nus.edu.sg/handle/10635/158676
dc.sourceCCK BATCHLOAD 20190911
dc.typeThesis
dc.contributor.departmentMECHANICAL ENGINEERING
dc.contributor.supervisorANDREW A.O. TAY
dc.description.degreeMaster's
dc.description.degreeconferredMASTER OF ENGINEERING
Appears in Collections:Master's Theses (Restricted)

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