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Wu, Jianhua

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Full Name
Wu, Jianhua
Variants
Wu, J.H.
Wu, J.
 
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Author:  Wu, J.H.

Results 1-7 of 7 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
1Sep-1998Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscopeLu, J.; Trigg, A.; Wu, J. ; Chai, T.
22000Effect of delamination on the thermal fatigue of solder joints in flip chipsOng, E.T.; Tay, A.A.O. ; Wu, J.H. 
3Feb-1995Effect of wirebond geometry and die setting on wire sweepTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
41997Numerical simulation of the flip-chip underfilling processTay, A.A.O. ; Huang, Z.M. ; Wu, J.H. ; Cui, C.Q. 
51995Simulation of three-dimensional wirebond deformation during transfer moldingTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. 
6Mar-1995Wirebond deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B. 
71993Wirebound deformation during molding of IC packagesTay, A.A.O. ; Yeo, K.S. ; Wu, J.H. ; Lim, T.B.