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Li Xiaoping

rp08482

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Full Name
Li Xiaoping
(not current staff)
Variants
Li, X.
Li', X.P.
LI, XIAOPING
Li, Xiaoping
Li, X.P
Xiaoping, L.
Li, X.P.
Li, X.-P.
 
Main Affiliation
 
Faculty
 
Email
mpelixp@nus.edu.sg
 

Publications

Results 161-180 of 185 (Search time: 0.005 seconds).

Issue DateTitleAuthor(s)
1611-Apr-2011Study of the magnetic anisotropy of micron-sized CoFeSiB glass covered amorphous wiresFan, J. ; Chiriac, H.; Li, X.P. 
2Apr-2007Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline siliconCai, M.B.; Li, X.P. ; Rahman, M. 
3Jan-2007Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulationCai, M.B.; Li, X.P. ; Rahman, M. 
4Oct-2009Study of the noise in multicore orthogonal fluxgate sensors based on Ni-Fe/Cu composite microwire arraysJie, F. ; Ning, N. ; Ji, W.; Chiriac, H.; Xiaoping, L. 
52003Study of the Parameters of Electroplating of Ferromagnetic Materials in Relation to Material PermeabilitySeet, H.L.; See, S.H.; Li, X.P. ; Teoh, S.H. ; Lim, C.T. ; Lee, J.Y. ; Lee, K.Y.T. 
62003Study of the Reinforcement Percentage of Mg-Al-SiC MMC in Relation to the Mechanical Properties and MachinabilityLi, X.P. ; Lu, L. 
720-Aug-2003Study of the surface integrity of the machined workpiece in the EDM of tungsten carbideLee, S.H.; Li, X. 
81-Oct-2007Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulationCai, M.B.; Li, X.P. ; Rahman, M. 
9Jun-2010Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon waferLi, X. ; Cai, M.; Rahman, M. ; Liang, S.
10Feb-2008Surface Review and Letters: PrefaceLi, X.P. ; Lu, L. ; Tu, J.P.; Zhao, X.B.; Zhu, T.J.
1115-Jan-1995The effect of applying coolant on tool wear in metal machiningSeah, K.H.W. ; Li, X. ; Lee, K.S. 
122006The effect of external magnetic field on magnetic film inductorsNing, N. ; Li, X. ; Seet, H. 
132007The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon waferArefin, S.; Li, X.P. ; Cai, M.B.; Rahman, M. ; Liu, K. ; Tay, A. 
54Jul-2007The mechanism of ductile chip formation in cutting of brittle materialsLiu, K.; Li, X.P. ; Liang, S.Y.
5518-Oct-2013The Synergy between Complex Channel-Specific FIR Filter and Spatial Filter for Single-Trial EEG ClassificationYu, K.; Wang, Y.; Shen, K. ; Li, X. 
116Jan-2007The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon waferArefin, S.; Li, X.P. ; Rahman, M. ; Liu, K. 
1171999Theoretical modelling and simulation of cutting forces in face milling with cutter runoutZheng, H.Q.; Li, X.P. ; Wong, Y.S. ; Nee, A.Y.C. 
1819-May-1999Theoretical modelling and simulation of milling forcesLi, X.P. ; Nee, A.Y.C. ; Wong, Y.S. ; Zheng, H.Q.
19Sep-2004Theoretical modelling of cutting forces in helical end milling with cutter runoutLi, X.P. ; Li, H.Z.
20Feb-2001Tool wear acceleration in relation to workpiece reinforcement percentage in cutting of metal matrix compositesLi, X. ; Seah, W.K.H.