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Chengkuo Lee

rp00168

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Full Name
Chengkuo Lee
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee
 
Main Affiliation
 
Faculty
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Author:  Lau, J.H.

Results 1-13 of 13 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
12008A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu jointYan, L.; Lee, C. ; Yu, D.; Choi, W.K.; Yu, A.; Yoon, S.U.; Lau, J.H.
22008Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packagingLee, C. ; Yu, D.; Yu, A.; Yan, L.; Wang, H.; Lau, J.H.
319-Oct-2009Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Thew, M.L.; Lau, J.H.
431-Aug-2009Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packagingLee, C. ; Yu, A.; Yan, L.; Wang, H.; He, J.H.; Zhang, Q.X.; Lau, J.H.
52008Design and modeling of nanophotonic beam structures as optical NEMS sensorsLee, C. ; Thillaigovindan, J.; Yu, A.; Radhakrishnan, R.; Chen, C.-C.; Chao, Y.-T.; Lau, J.H.
62008Development of low temperature bonding using in-based soldersChoi, W.K.; Yu, D.; Lee, C. ; Yan, L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Cho, M.G.; Jo, Y.H.; Lee, H.M.
72008Development of wafer level packaged scanning micromirrorsYu, A.; Lee, C. ; Yan, L.L.; Zhang, Q.X.; Yoon, S.U.; Lau, J.H.
82008Study of Ag-In solder as low temperature wafer bonding intermediate layerMade, R.I.; Gan, C.L.; Lee, C. ; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.
9Feb-2009Study of low-temperature thermocompression bonding in Ag-In solder for packaging applicationsMade, R.I.; Gan, C.L.; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Lee, C. 
102009The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Choi, W.K.; Yu, A.; Lau, J.H.
112008The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bondingYu, D.; Lee, C. ; Lau, J.H.
122008Wafer level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.; Yan, L.; Lee, C. ; Choi, W.K.; Thew, M.L.; Foo, C.K.; Lau, J.H.
13Dec-2009Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallizationYu, D.-Q.; Yan, L.L.; Lee, C. ; Choi, W.K.; Thew, S.; Foo, C.K.; Lau, J.H.