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Chengkuo Lee

rp00168

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Full Name
Chengkuo Lee
Variants
Lee, C.-K.
Lee Chengkuo
Chengkuo, L.
Lee, C.
Lee, C.K.
Lee Chengkun
Lee Cheng Kuo
Lee, Vincent Ch
Vincent Lee
 
Main Affiliation
 
Faculty
 
Email
elelc@nus.edu.sg
 

Publications

Refined By:
Author:  Yu, A.

Results 1-13 of 13 (Search time: 0.004 seconds).

Issue DateTitleAuthor(s)
12008A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu jointYan, L.; Lee, C. ; Yu, D.; Choi, W.K.; Yu, A.; Yoon, S.U.; Lau, J.H.
22008Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packagingLee, C. ; Yu, D.; Yu, A.; Yan, L.; Wang, H.; Lau, J.H.
331-Aug-2009Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packagingLee, C. ; Yu, A.; Yan, L.; Wang, H.; He, J.H.; Zhang, Q.X.; Lau, J.H.
42008Design and modeling of nanophotonic beam structures as optical NEMS sensorsLee, C. ; Thillaigovindan, J.; Yu, A.; Radhakrishnan, R.; Chen, C.-C.; Chao, Y.-T.; Lau, J.H.
52008Development of low temperature bonding using in-based soldersChoi, W.K.; Yu, D.; Lee, C. ; Yan, L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Cho, M.G.; Jo, Y.H.; Lee, H.M.
62008Development of wafer level packaged scanning micromirrorsYu, A.; Lee, C. ; Yan, L.L.; Zhang, Q.X.; Yoon, S.U.; Lau, J.H.
72008Effect of bonding pressure on the bond strengths of low temperature Ag-In bondsMade, R.I.; Gan, C.L.; Lee, C. ; Yan, L.; Yu, A.; Yoon, S.W.
82008Nanophotonics based cantilever sensorLee, C. ; Thillaigovindan, J.; Chen, C.-C.; Chen, X.T.; Chao, Y.T.; Tao, S.; Xiang, W. ; Yu, A.; Feng, H.; Lo, G.Q.
9Jul-2011Novel piezoelectric actuation mechanism for a gimbal-less mirror in 2D raster scanning applicationsKoh, K.H.; Kobayashi, T.; Xie, J.; Yu, A.; Lee, C. 
102008Si nanophotonics based cantilever sensorLee, C. ; Thillaigovindan, J.; Chen, C.-C.; Chen, X.T.; Chao, Y.-T.; Tao, S.; Xiang, W. ; Yu, A.; Feng, H.; Lo, G.Q.
112008Study of Ag-In solder as low temperature wafer bonding intermediate layerMade, R.I.; Gan, C.L.; Lee, C. ; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.
12Feb-2009Study of low-temperature thermocompression bonding in Ag-In solder for packaging applicationsMade, R.I.; Gan, C.L.; Yan, L.L.; Yu, A.; Yoon, S.W.; Lau, J.H.; Lee, C. 
132009The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallizationYu, D.-Q.; Lee, C. ; Yan, L.L.; Choi, W.K.; Yu, A.; Lau, J.H.