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| | Issue Date | Title | Author(s) |
| 8821 | 2015 | Boundary regularized integral equation formulation of the Helmholtz equation in acoustics | Sun Q. ; Klaseboer E.; Khoo B.-C. ; Chan D.Y.C. |
| 8822 | 2015 | Boundary regularized integral equation formulation of Stokes flow | Sun, Qiang ; Klaseboer, Evert; Khoo, Boo Cheong ; CHAN YAU CHEONG,DEREK |
| 8823 | 13-Jan-2020 | BOUNDARY NON-CONFORMING METHODS FOR FLUID-STRUCTURE INTERACTION PROBLEMS | B HARIKRISHNAN |
| 8824 | 2002 | Boundary meshfree methods based on the boundary point interpolation methods | Liu, G.R. ; Gu, Y.T. |
| 5 | May-2004 | Boundary meshfree methods based on the boundary point interpolation methods | Liu, G.R. ; Gu, Y.T. |
| 6 | 20-Jan-2016 | BOUNDARY LAYER ON FLAT PLATE WITH LEADING EDGE PATTERNS | SEYED MOHAMMAD HASHEMINEJAD |
| 7 | Jan-2004 | Boundary integral equations as applied to an oscillating bubble near a fluid-fluid interface | Klaseboer, E.; Khoo, B.C. |
| 8 | Nov-2012 | Boundary element analysis of the droplet dynamics induced by spark-generated bubble | Dadvand, A.; Khoo, B.C. ; Shervani-Tabar, M.T.; Khalilpourazary, S. |
| 9 | 1998 | Boundary element analysis of delamination in IC packages | Tay, A.A.O. ; Lee, K.H. ; Lim, K.M. |
| 10 | 10-Jul-2009 | Boundary conditions at the interface between fluid layer and fibrous medium | Bai, H.X.; Yu, P. ; Winoto, S.H. ; Low, H.T. |
| 11 | 30-Mar-2012 | Boundary condition-enforced immersed boundary method for thermal flow problems with Dirichlet temperature condition and its applications | Ren, W.W.; Shu, C. ; Wu, J.; Yang, W.M. |
| 12 | Jan-2013 | Bound Water Content in Wet Materials | Lee, D.-J.; Su, A.; Mujumdar, A.S. |
| 13 | Apr-2008 | Bone material properties and fracture analysis: Needle insertion for spinal surgery | Teoh, S.H. ; Chui, C.K. |
| 14 | Mar-1996 | Bonded boron-epoxy composite repair and reinforcement of cracked aluminium structures | Tay, T.E. ; Chau, F.S. ; Er, C.J. |
| 15 | 22-Mar-2005 | Board level drop testing of advanced IC packaging | PEK WEE SONG, ERIC |
| 16 | 2005 | Board level drop test reliability of IC packages | Chai, T.C.; Quek, S.; Hnin, W.Y.; Wong, E.H.; Chia, J.; Wang, Y.Y.; Tan, Y.M.; Lim, C.T. |
| 17 | 2003 | Board level drop test and simulation of TFBGA packages for telecommunication applications | Tee, T.Y.; Ng, H.S.; Lim, C.T. ; Pek, E.; Zhong, Z. |
| 18 | 2009 | BMSC Sheets for Ligament Tissue Engineering | See, E.Y.S. ; Toh, S.L. ; Goh, J.C.H. |
| 19 | 26-Feb-2004 | Bluetooth wireless communication for MEMSwear | CHONG FOH WOOI |
| 20 | 2007 | Blowing and suction effects on vortex breakdown in an enclosed cylindrical container | Cui, Y.D. ; Lim, T.T. ; Tsai, H.M. |
