Please use this identifier to cite or link to this item:
|Title:||Wedge indentation studies of low-k films at inert, water and ambient environments|
|Source:||Yeap, K.B., Zeng, K., Chi, D. (2009-08-25). Wedge indentation studies of low-k films at inert, water and ambient environments. Materials Science and Engineering A 518 (1-2) : 132-138. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2009.04.030|
|Abstract:||Wedge indentation experiments are performed to study the time-dependent fracture behavior of silica-based low-k films, namely BlackDiamond® (BD) film and methysilsesquoxane (MSQ) film, both on Si substrate. Two wedge indentation tests, load-holding and varying-loading-rates tests, are performed in this study. It is found that the chemical structure of the low-k films greatly influences the crack growth during the load-holding and varying-loading-rates tests. For the MSQ/Si system, continuously increasing indentation load to above the critical load (>2 mN) is required for crack growth; while for the BD/Si system, spending excessive period of time at below the critical load (|
|Source Title:||Materials Science and Engineering A|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Apr 3, 2018
checked on Apr 20, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.