Wedge indentation studies of low-k films at inert, water and ambient environments

Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.msea.2009.04.030

Title:	Wedge indentation studies of low-k films at inert, water and ambient environments
Authors:	Yeap, K.B. Zeng, K. Chi, D.
Keywords:	Low-k films Time-dependent deformation Wedge indentation
Issue Date:	25-Aug-2009
Citation:	Yeap, K.B., Zeng, K., Chi, D. (2009-08-25). Wedge indentation studies of low-k films at inert, water and ambient environments. Materials Science and Engineering A 518 (1-2) : 132-138. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2009.04.030
Abstract:	Wedge indentation experiments are performed to study the time-dependent fracture behavior of silica-based low-k films, namely BlackDiamond® (BD) film and methysilsesquoxane (MSQ) film, both on Si substrate. Two wedge indentation tests, load-holding and varying-loading-rates tests, are performed in this study. It is found that the chemical structure of the low-k films greatly influences the crack growth during the load-holding and varying-loading-rates tests. For the MSQ/Si system, continuously increasing indentation load to above the critical load (>2 mN) is required for crack growth; while for the BD/Si system, spending excessive period of time at below the critical load (
Source Title:	Materials Science and Engineering A
URI:	http://scholarbank.nus.edu.sg/handle/10635/85838
ISSN:	09215093
DOI:	10.1016/j.msea.2009.04.030
Appears in Collections:	Staff Publications

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