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Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.msea.2009.04.030
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dc.titleWedge indentation studies of low-k films at inert, water and ambient environments
dc.contributor.authorYeap, K.B.
dc.contributor.authorZeng, K.
dc.contributor.authorChi, D.
dc.date.accessioned2014-10-07T09:12:48Z
dc.date.available2014-10-07T09:12:48Z
dc.date.issued2009-08-25
dc.identifier.citationYeap, K.B., Zeng, K., Chi, D. (2009-08-25). Wedge indentation studies of low-k films at inert, water and ambient environments. Materials Science and Engineering A 518 (1-2) : 132-138. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2009.04.030
dc.identifier.issn09215093
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85838
dc.description.abstractWedge indentation experiments are performed to study the time-dependent fracture behavior of silica-based low-k films, namely BlackDiamond® (BD) film and methysilsesquoxane (MSQ) film, both on Si substrate. Two wedge indentation tests, load-holding and varying-loading-rates tests, are performed in this study. It is found that the chemical structure of the low-k films greatly influences the crack growth during the load-holding and varying-loading-rates tests. For the MSQ/Si system, continuously increasing indentation load to above the critical load (>2 mN) is required for crack growth; while for the BD/Si system, spending excessive period of time at below the critical load (
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.msea.2009.04.030
dc.sourceScopus
dc.subjectLow-k films
dc.subjectTime-dependent deformation
dc.subjectWedge indentation
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.msea.2009.04.030
dc.description.sourcetitleMaterials Science and Engineering A
dc.description.volume518
dc.description.issue1-2
dc.description.page132-138
dc.identifier.isiut000268532300020
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