Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2007.4469749
Title: Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
Authors: Zaw, Z.O.
Liu, E.
Wei, X.C.
Li, E. 
Chua, E.K.
Li, L.-W. 
Issue Date: 2007
Source: Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W. (2007). Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias. Proceedings of the Electronic Packaging Technology Conference, EPTC : 421-424. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469749
Abstract: A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel-plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response. © 2007 IEEE.
Source Title: Proceedings of the Electronic Packaging Technology Conference, EPTC
URI: http://scholarbank.nus.edu.sg/handle/10635/71175
ISBN: 1424413249
DOI: 10.1109/EPTC.2007.4469749
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