Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias

Abstract

A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel-plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response. © 2007 IEEE.