Please use this identifier to cite or link to this item:
|Title:||Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias|
|Citation:||Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W. (2007). Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias. Proceedings of the Electronic Packaging Technology Conference, EPTC : 421-424. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469749|
|Abstract:||A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel-plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response. © 2007 IEEE.|
|Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Oct 8, 2018
checked on Oct 13, 2018
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.