Please use this identifier to cite or link to this item:
https://doi.org/10.1109/EPTC.2007.4469749
DC Field | Value | |
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dc.title | Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias | |
dc.contributor.author | Zaw, Z.O. | |
dc.contributor.author | Liu, E. | |
dc.contributor.author | Wei, X.C. | |
dc.contributor.author | Li, E. | |
dc.contributor.author | Chua, E.K. | |
dc.contributor.author | Li, L.-W. | |
dc.date.accessioned | 2014-06-19T03:20:45Z | |
dc.date.available | 2014-06-19T03:20:45Z | |
dc.date.issued | 2007 | |
dc.identifier.citation | Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W. (2007). Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias. Proceedings of the Electronic Packaging Technology Conference, EPTC : 421-424. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469749 | |
dc.identifier.isbn | 1424413249 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/71175 | |
dc.description.abstract | A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel-plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response. © 2007 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2007.4469749 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/EPTC.2007.4469749 | |
dc.description.sourcetitle | Proceedings of the Electronic Packaging Technology Conference, EPTC | |
dc.description.page | 421-424 | |
dc.identifier.isiut | 000253874600077 | |
Appears in Collections: | Staff Publications |
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