Please use this identifier to cite or link to this item: https://doi.org/10.1109/TADVP.2008.923379
Title: A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias
Authors: Oo, Z.Z.
Liu, E.-X.
Li, E.-P. 
Wei, X.
Zhang, Y.
Tan, M.
Li, L.-W.J. 
Vahldieck, R.
Keywords: Electronic package
Modal expansion
Power integrity
Signal integrity
System-level modeling
Issue Date: May-2008
Source: Oo, Z.Z., Liu, E.-X., Li, E.-P., Wei, X., Zhang, Y., Tan, M., Li, L.-W.J., Vahldieck, R. (2008-05). A semi-analytical approach for system-level electrical modeling of electronic packages with large number of vias. IEEE Transactions on Advanced Packaging 31 (2) : 267-274. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.923379
Abstract: This paper presents a semi-analytical approach for electrical performance modeling of complex electronic packages with multiple power/ ground planes and large number of vias. The method is based on the modal expansion technique and the method of moments. For the inner package domain with multiple power/ground planes and many vias, the modal expansion method is employed to compute the electromagnetic fields from which the multiport network parameters, e.g., the admittance matrix can be easily obtained. For the top/bottom domain of signal layers, the moment method is used to extract the equivalent resistance, inductance, capacitance, and conductance (RLCG) parameters. The equivalent circuit for the entire package is then generated by combining the results for both package domains. The equivalent circuit can be used in a SPICE-like simulator to study the signal and power integrity of an electronic package. Numerical examples demonstrate that the new approach is able to provide fast yet accurate signal and power integrity analysis of multilayered electronic packages. © 2008 IEEE.
Source Title: IEEE Transactions on Advanced Packaging
URI: http://scholarbank.nus.edu.sg/handle/10635/54802
ISSN: 15213323
DOI: 10.1109/TADVP.2008.923379
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