Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.486521
Title: Laser-ablation for MEMS microfabrication on Si and Kapton substrates
Authors: Lan, B. 
Hong, M.H.
Ye, K.D.
Chen, S.X.
Chong, T.C.
Keywords: Diffraction rings
Drilling
Kapton
Laser ablation
Nozzle
Via hole
Issue Date: 2002
Source: Lan, B., Hong, M.H., Ye, K.D., Chen, S.X., Chong, T.C. (2002). Laser-ablation for MEMS microfabrication on Si and Kapton substrates. Proceedings of SPIE - The International Society for Optical Engineering 4830 : 196-200. ScholarBank@NUS Repository. https://doi.org/10.1117/12.486521
Abstract: Laser-ablation-based microfabrication technology is applied to fabricate micro-electro-mechanical-systems (MEMS) devices on polymer substrates. A micromachining apparatus is designed and developed which includes a 355 nm laser, an uncoated focusing lens, computer-controlled precision x-y-z stages and in-situ process monitoring systems. Concentric rings microstractures are formed by efficiently changing the laser intensity distribution. Tiny via holes and micro-nozzles with different diameters have been obtained by low power laser direct drilling. Optical microscopy and scanning electron microscopy (SEM) are used to evaluate the processing results at different laser processing parameters. This method has the advantages of low-cost and time-saving in circle via holes fabrications. Potential applications of this novel MEMS fabrication technique are also briefed.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
URI: http://scholarbank.nus.edu.sg/handle/10635/40856
ISSN: 0277786X
DOI: 10.1117/12.486521
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