Please use this identifier to cite or link to this item: https://doi.org/10.1063/1.1466521
DC FieldValue
dc.titleStructural study of refractory-metal-free C40 TiSi2 and its transformation to C54 TiSi2
dc.contributor.authorYu, T.
dc.contributor.authorTan, S.C.
dc.contributor.authorShen, Z.X.
dc.contributor.authorChen, L.W.
dc.contributor.authorLin, J.Y.
dc.contributor.authorSee, A.K.
dc.date.accessioned2014-10-16T09:42:33Z
dc.date.available2014-10-16T09:42:33Z
dc.date.issued2002-04-01
dc.identifier.citationYu, T., Tan, S.C., Shen, Z.X., Chen, L.W., Lin, J.Y., See, A.K. (2002-04-01). Structural study of refractory-metal-free C40 TiSi2 and its transformation to C54 TiSi2. Applied Physics Letters 80 (13) : 2266-2268. ScholarBank@NUS Repository. https://doi.org/10.1063/1.1466521
dc.identifier.issn00036951
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/98063
dc.description.abstractThe structure of laser-induced refractory-metal-free C40 TiSi2 has been studied by glancing-angle x-ray diffraction (GAXRD) in detail. The result shows that laser-induced C40 TiSi2 has a hexagonal structure with the P6222 space group and lattice parameters a=0.467 nm and c=0.662 nm. The ordering effect and the stress effect on the TiSi2 film are also discussed based on the GAXRD and micro-Raman results. The C40 phase completely transforms to the technologically important C54 phase at a relatively low temperature of 700°C. © 2002 American Institute of Physics.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1063/1.1466521
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.description.doi10.1063/1.1466521
dc.description.sourcetitleApplied Physics Letters
dc.description.volume80
dc.description.issue13
dc.description.page2266-2268
dc.description.codenAPPLA
dc.identifier.isiut000174623300010
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.