Please use this identifier to cite or link to this item: https://doi.org/10.1149/1.1632873
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dc.titleReduction of Polysilicon Gate Depletion Effect in NMOS Devices Using Laser Thermal Processing
dc.contributor.authorChong, Y.F.
dc.contributor.authorGossmann, H.-J.L.
dc.contributor.authorPey, K.L.
dc.contributor.authorThompson, M.O.
dc.contributor.authorWee, A.T.S.
dc.contributor.authorTung, C.H.
dc.date.accessioned2014-10-16T09:39:16Z
dc.date.available2014-10-16T09:39:16Z
dc.date.issued2004
dc.identifier.citationChong, Y.F., Gossmann, H.-J.L., Pey, K.L., Thompson, M.O., Wee, A.T.S., Tung, C.H. (2004). Reduction of Polysilicon Gate Depletion Effect in NMOS Devices Using Laser Thermal Processing. Electrochemical and Solid-State Letters 7 (2) : G25-G27. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1632873
dc.identifier.issn10990062
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/97783
dc.description.abstractOne critical issue in advanced semiconductor processing is to have adequate dopant activation in the polycrystalline silicon (poly-Si) gate to minimize carrier depletion at the gate/gate oxide interface (poly-depletion). We demonstrate a novel technique, using laser thermal processing, to form super-doped n+-poly-Si gates on ultrathin gate oxides. The results indicate that the poly-depletion effect in n-channel metal-oxide-semiconductor (NMOS) devices can be significantly reduced if the entire as-deposited amorphous silicon gate melts upon laser irradiation. Time-dependent dielectric breakdown studies show that the gate oxide reliability is not degraded even after laser processing at a high fluence. © 2003 The Electrochemical Society. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1149/1.1632873
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.description.doi10.1149/1.1632873
dc.description.sourcetitleElectrochemical and Solid-State Letters
dc.description.volume7
dc.description.issue2
dc.description.pageG25-G27
dc.description.codenESLEF
dc.identifier.isiut000188080600012
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