Please use this identifier to cite or link to this item: https://doi.org/10.1088/0960-1317/22/1/015015
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dc.titleFabrication of complex curved three-dimensional silicon microstructures using ion irradiation
dc.contributor.authorAzimi, S.
dc.contributor.authorBreese, M.B.H.
dc.contributor.authorDang, Z.Y.
dc.contributor.authorYan, Y.
dc.contributor.authorOw, Y.S.
dc.contributor.authorBettiol, A.A.
dc.date.accessioned2014-10-16T09:25:12Z
dc.date.available2014-10-16T09:25:12Z
dc.date.issued2012-01
dc.identifier.citationAzimi, S., Breese, M.B.H., Dang, Z.Y., Yan, Y., Ow, Y.S., Bettiol, A.A. (2012-01). Fabrication of complex curved three-dimensional silicon microstructures using ion irradiation. Journal of Micromechanics and Microengineering 22 (1) : -. ScholarBank@NUS Repository. https://doi.org/10.1088/0960-1317/22/1/015015
dc.identifier.issn09601317
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/96590
dc.description.abstractWe have developed a process to fabricate arbitrary-shaped, three-dimensional microstructures in 0.4 cm p-type silicon using focused high-energy proton beam irradiation, followed by electrochemical anodization. This has enabled us to produce free-standing complex microstructures such as arrays or long wires, grids, wheels, vertically stacked wires and wires which can be controllably bent upward and downward in the vertical plane. The two most important factors which determine the wire cross-section dimensions and depth are the irradiation ion fluence and energy. We can controllably vary the width of wires from 1 to 5 νm by varying the fluence of 1 MeV protons and the depth of wires from 2 to 15 νm by varying the proton energy. By using a combination of multiple energy proton irradiation over a range of 2001000 keV, and gray-scale masks, different ion penetration depths and multilevel free-standing three-dimensional silicon structures can be obtained in a single etch step. © 2012 IOP Publishing Ltd.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.description.doi10.1088/0960-1317/22/1/015015
dc.description.sourcetitleJournal of Micromechanics and Microengineering
dc.description.volume22
dc.description.issue1
dc.description.page-
dc.description.codenJMMIE
dc.identifier.isiut000298662800016
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