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https://doi.org/10.1002/pen.10875
DC Field | Value | |
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dc.title | Anisotropic dielectric properties of polyimides consisting of various molar ratios of mete to para diamine with trifluoromethyl group | |
dc.contributor.author | Qu, W.-L. | |
dc.contributor.author | Ko, T.-M. | |
dc.contributor.author | Vora, R.H. | |
dc.contributor.author | Chung, T.-S. | |
dc.date.accessioned | 2014-10-09T09:51:40Z | |
dc.date.available | 2014-10-09T09:51:40Z | |
dc.date.issued | 2001-10 | |
dc.identifier.citation | Qu, W.-L., Ko, T.-M., Vora, R.H., Chung, T.-S. (2001-10). Anisotropic dielectric properties of polyimides consisting of various molar ratios of mete to para diamine with trifluoromethyl group. Polymer Engineering and Science 41 (10) : 1783-1793. ScholarBank@NUS Repository. https://doi.org/10.1002/pen.10875 | |
dc.identifier.issn | 00323888 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/91871 | |
dc.description.abstract | A series of copolylmldes based on pyromellitic dianhydride (PMDA) with various molar fractions of 4,4′-(hexafluoro-isopropylidene)dianiline (4,4′-6F) and 3,3′-(hexafluoro-isopropylidene)dianiline (3,3′-6F) were synthesized by a two-step method. The five different composition copolyimides in the form of [(PMDA+3,3′-6F)m/ (PMDA+4,4′-6F)n] were mainly characterized using a dielectric analyzer (DEA) by single surface sensor (in-plane direction) and thin film parallel plate sensor (out-of-plane direction) measurements. DSC, TMA, and XRD were also used to study the structure property. The increasing of molar ratio of para diamine in the copolyimide system up to 35% affected glass transition temperature, coefficient of thermal expansion, in-plane dielectric constant and out-of-plane dielectric constant of copolyimides, correspondingly. The in-plane dielectric constant was higher than that of the out-of plane constant for our polyimide films. Anisotropy Δε of the dielectric constants was 0.14 for CPI(100/0)a, 0.19 for CPI(85/15)a, 0.11 for CPI(75/ 25)a, and 0.05 for CPI(65/35)a. The difference in curing history also exhibited an effect on solvent diffusion behavior in our polymer system. Polymers cured at a slower curing rate had smaller CTE than that cured at a faster curing rate, as confirmed by X-ray diffraction results. Polymers with smaller CTEs had larger dielectric constants at a slower curing rate, and vice versa. The experimental results suggested that CPI(65/35)a with smaller dielectric anisotropy could solve the crosstalk problem and provide equal electrical insulation in microelectronic devices. Therefore, a smaller and faster IC device could, it is hoped, be achieved, with smaller spacing between adjacent metal lines. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1002/pen.10875 | |
dc.source | Scopus | |
dc.type | Article | |
dc.contributor.department | CHEMICAL & ENVIRONMENTAL ENGINEERING | |
dc.description.doi | 10.1002/pen.10875 | |
dc.description.sourcetitle | Polymer Engineering and Science | |
dc.description.volume | 41 | |
dc.description.issue | 10 | |
dc.description.page | 1783-1793 | |
dc.description.coden | PYESA | |
dc.identifier.isiut | 000171928700013 | |
Appears in Collections: | Staff Publications |
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