Please use this identifier to cite or link to this item: https://doi.org/10.1021/ie070478c
DC FieldValue
dc.titlePhotocatalytic treatment of wastewater contaminated with organic waste and copper ions from the semiconductor industry
dc.contributor.authorZou, S.-W.
dc.contributor.authorHow, C.-W.
dc.contributor.authorChen, J.P.
dc.date.accessioned2014-10-08T08:33:16Z
dc.date.available2014-10-08T08:33:16Z
dc.date.issued2007-09-26
dc.identifier.citationZou, S.-W., How, C.-W., Chen, J.P. (2007-09-26). Photocatalytic treatment of wastewater contaminated with organic waste and copper ions from the semiconductor industry. Industrial and Engineering Chemistry Research 46 (20) : 6566-6571. ScholarBank@NUS Repository. https://doi.org/10.1021/ie070478c
dc.identifier.issn08885885
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/87589
dc.description.abstractSimultaneous decontamination of organic compounds and copper ions in the wastewater discharged from semiconductor manufacturing facilities by a UV/TiO2 photocatalytic degradation was investigated in this study. Two organic compounds of ethyl lactate and phenol and copper ions were studied due to their common applications in various wafer fabrication processes and higher toxicities. The optimal TiO2 dosage and initial pH for the photocatalytic oxidation of ethyl lactate and phenol were 0.1 g/L and 3.0-4.0. Photocatalytic degradation under these optimal conditions was able to simultaneously mineralize those solvents and remove copper(II) in the synthetic wastewater. Under anoxic condition, oxygen inhibited copper reduction and copper(II) ions were removed through precipitation. Under anaerobic conditions, the removal rate of copper(II) ions and the rate of reduction of the organic solvents content were lower than that in the aerobic condition. © 2007 American Chemical Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1021/ie070478c
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentDIVISION OF ENVIRONMENTAL SCIENCE & ENGG
dc.description.doi10.1021/ie070478c
dc.description.sourcetitleIndustrial and Engineering Chemistry Research
dc.description.volume46
dc.description.issue20
dc.description.page6566-6571
dc.description.codenIECRE
dc.identifier.isiut000249610000023
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