Please use this identifier to cite or link to this item: https://doi.org/10.1021/nl101790k
DC FieldValue
dc.titleHeat conduction across monolayer and few-layer graphenes
dc.contributor.authorKoh, Y.K.
dc.contributor.authorBae, M.-H.
dc.contributor.authorCahill, D.G.
dc.contributor.authorPop, E.
dc.date.accessioned2014-10-07T09:05:53Z
dc.date.available2014-10-07T09:05:53Z
dc.date.issued2010-11-10
dc.identifier.citationKoh, Y.K., Bae, M.-H., Cahill, D.G., Pop, E. (2010-11-10). Heat conduction across monolayer and few-layer graphenes. Nano Letters 10 (11) : 4363-4368. ScholarBank@NUS Repository. https://doi.org/10.1021/nl101790k
dc.identifier.issn15306984
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85257
dc.description.abstractWe report the thermal conductance G of Au/Ti/graphene/SiO2 interfaces (graphene layers 1 ≤ n ≤ 10) typical of graphene transistor contacts. We find G ≈ 25 MW m-2 K-1 at room temperature, four times smaller than the thermal conductance of a Au/Ti/ SiO2 interface, even when n = 1. We attribute this reduction to the thermal resistance of Au/Ti/graphene and graphene/SiO2 interfaces acting in series. The temperature dependence of G from 50 ≤ T ≤ 500 K also indicates that heat is predominantly carried by phonons through these interfaces. Our findings suggest that metal contacts can limit not only electrical transport but also thermal dissipation from submicrometer graphene devices. © 2010 American Chemical Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1021/nl101790k
dc.sourceScopus
dc.subjectacoustic phonons
dc.subjectfew-layer graphene
dc.subjectheat dissipation
dc.subjectInterfacial thermal conductance
dc.subjectmetal contacts
dc.subjectthermal management of graphene devices
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1021/nl101790k
dc.description.sourcetitleNano Letters
dc.description.volume10
dc.description.issue11
dc.description.page4363-4368
dc.identifier.isiut000283907600012
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