Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators

Please use this identifier to cite or link to this item: https://doi.org/10.1109/MEMSYS.2010.5442421

Title:	Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators
Authors:	Xie, J. Lee, C. Wang, M.-F. Feng, H.
Issue Date:	2010
Citation:	Xie, J.,Lee, C.,Wang, M.-F.,Feng, H. (2010). Wafer-level vacuum sealing and encapsulation for fabrication of CMOS MEMS thermoelectric power generators. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) : 1175-1178. ScholarBank@NUS Repository. https://doi.org/10.1109/MEMSYS.2010.5442421
Abstract:	This paper presents technologies of wafer-level vacuum sealing and encapsulation at low temperature with CMOS compatible process and materials for fabrication of thermoelectric power generators (TPGs). A novel design of TPG with thermal legs embedded in the cavities is proposed. Results of simulation validate that the two cavities maximize the temperature difference between the hot and cold junctions of thermocouples. With the verified technologies of wafer-level vacuum sealing and encapsulation, a thermoelectric power generator is developed based on heavily p- and n-doped polysilicon. The fabricated power generator has a power efficiency factor of 0.052 μWcm-2K -2. ©2010 IEEE.
Source Title:	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
URI:	http://scholarbank.nus.edu.sg/handle/10635/84359
ISBN:	9781424457649
ISSN:	10846999
DOI:	10.1109/MEMSYS.2010.5442421
Appears in Collections:	Staff Publications

There are no files associated with this item.

Check