Please use this identifier to cite or link to this item:
https://doi.org/10.1109/VLSI-TSA.2013.6545609
DC Field | Value | |
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dc.title | Novel technique comprising silane treatment and laser anneal for abrupt ultra-shallow junction formation for InGaAs n-MOSFETs | |
dc.contributor.author | Kong, E. | |
dc.contributor.author | Gong, X. | |
dc.contributor.author | Guo, P. | |
dc.contributor.author | Liu, B. | |
dc.contributor.author | Yeo, Y.-C. | |
dc.date.accessioned | 2014-10-07T04:47:54Z | |
dc.date.available | 2014-10-07T04:47:54Z | |
dc.date.issued | 2013 | |
dc.identifier.citation | Kong, E.,Gong, X.,Guo, P.,Liu, B.,Yeo, Y.-C. (2013). Novel technique comprising silane treatment and laser anneal for abrupt ultra-shallow junction formation for InGaAs n-MOSFETs. 2013 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2013 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/VLSI-TSA.2013.6545609" target="_blank">https://doi.org/10.1109/VLSI-TSA.2013.6545609</a> | |
dc.identifier.isbn | 9781467330817 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/84023 | |
dc.description.abstract | A novel technique for doping the source/drain or source/drain extension regions of InGaAs MOSFETs was developed based on silane treatment and laser anneal. This doping technique has the potential to provide conformal, ultra-shallow, and very abrupt n++ junctions while being free from implant damage, and is first demonstrated in planar InGaAs MOSFETs. © 2013 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/VLSI-TSA.2013.6545609 | |
dc.source | Scopus | |
dc.type | Conference Paper | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/VLSI-TSA.2013.6545609 | |
dc.description.sourcetitle | 2013 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2013 | |
dc.description.page | - | |
dc.identifier.isiut | NOT_IN_WOS | |
Appears in Collections: | Staff Publications |
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