Please use this identifier to cite or link to this item: https://doi.org/10.1109/IEDM.2013.6724643
DC FieldValue
dc.titleNear ballistic sub-7 nm Junctionless FET featuring 1 nm extremely-thin channel and raised S/D structure
dc.contributor.authorGoh, K.H.
dc.contributor.authorGuo, Y.
dc.contributor.authorGong, X.
dc.contributor.authorLiang, G.-C.
dc.contributor.authorYeo, Y.-C.
dc.date.accessioned2014-10-07T04:47:39Z
dc.date.available2014-10-07T04:47:39Z
dc.date.issued2013
dc.identifier.citationGoh, K.H.,Guo, Y.,Gong, X.,Liang, G.-C.,Yeo, Y.-C. (2013). Near ballistic sub-7 nm Junctionless FET featuring 1 nm extremely-thin channel and raised S/D structure. Technical Digest - International Electron Devices Meeting, IEDM : 16.5.1-16.5.4. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IEDM.2013.6724643" target="_blank">https://doi.org/10.1109/IEDM.2013.6724643</a>
dc.identifier.isbn9781479923076
dc.identifier.issn01631918
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/84001
dc.description.abstractIn this work, we report the realization of In0.53Ga 0.47As Junctionless FET (JLFET) with the shortest reported channel length Lch (6 nm) for any III-V transistors. The JLFET features a 1 nm-thick extremely-thin channel sandwiched between a 1 nm-thick InP cap and the InP substrate, and a heavily doped raised S/D structure. Peak transconductance Gm. Peak of 1480 μS/μm at VDS = 0.7 V with an EOT of 2.5 nm and an ultra-low S/D resistance RSD of 165 Ω.μm were achieved. In addition, the ballistic behavior of sub-7 nm III-V transistors was experimentally investigated by using a novel extraction approach for the first time. The In0.53Ga0.47As JLFET with LCH of 6 nm was demonstrated to have a mean free path λ of 27.2 nm and nearly ballistic transport with ballistic efficiency B of 0.82. © 2013 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/IEDM.2013.6724643
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/IEDM.2013.6724643
dc.description.sourcetitleTechnical Digest - International Electron Devices Meeting, IEDM
dc.description.page16.5.1-16.5.4
dc.description.codenTDIMD
dc.identifier.isiutNOT_IN_WOS
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