Please use this identifier to cite or link to this item: https://doi.org/10.1149/2.013304jss
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dc.titleRelaxed and strained patterned germanium-tin structures: A Raman scattering study
dc.contributor.authorCheng, R.
dc.contributor.authorWang, W.
dc.contributor.authorGong, X.
dc.contributor.authorSun, L.
dc.contributor.authorGuo, P.
dc.contributor.authorHu, H.
dc.contributor.authorShen, Z.
dc.contributor.authorHan, G.
dc.contributor.authorYeo, Y.-C.
dc.date.accessioned2014-10-07T04:35:43Z
dc.date.available2014-10-07T04:35:43Z
dc.date.issued2013
dc.identifier.citationCheng, R., Wang, W., Gong, X., Sun, L., Guo, P., Hu, H., Shen, Z., Han, G., Yeo, Y.-C. (2013). Relaxed and strained patterned germanium-tin structures: A Raman scattering study. ECS Journal of Solid State Science and Technology 2 (4) : P138-P145. ScholarBank@NUS Repository. https://doi.org/10.1149/2.013304jss
dc.identifier.issn21628769
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82973
dc.description.abstractWe report the first realization of fully-released and relaxed Ge 1-xSnx structures on Ge substrate. The coefficients of Raman peak shift a and b due to the alloy disorder and strain, respectively, were experimentally obtained for Ge1-xSnx. In addition, to lower the Sn composition needed to achieve direct bandgap Ge 1-xSnx alloys and also to realize channel materials with higher electron mobility, uniaxially tensile strained Ge1-xSn x patterns were fabricated. Large tensile strain (>1%) was detected in the patterned Ge1-xSnx lines. Such tensile-strained Ge1-xSnx structures could enable the realization of Group-IV optoelectronic devices and high mobility n-channel transistors. © 2013 The Electrochemical Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1149/2.013304jss
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1149/2.013304jss
dc.description.sourcetitleECS Journal of Solid State Science and Technology
dc.description.volume2
dc.description.issue4
dc.description.pageP138-P145
dc.identifier.isiut000319455900009
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