Please use this identifier to cite or link to this item: https://doi.org/10.1109/TED.2008.927391
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dc.titleNovel rare-earth dielectric interlayers for wide NMOS work-function tunability in Ni-FUSI gates
dc.contributor.authorLim, A.E.-J.
dc.contributor.authorLee, R.T.P.
dc.contributor.authorSamudra, G.S.
dc.contributor.authorKwong, D.-L.
dc.contributor.authorYeo, Y.-C.
dc.date.accessioned2014-10-07T04:33:31Z
dc.date.available2014-10-07T04:33:31Z
dc.date.issued2008
dc.identifier.citationLim, A.E.-J., Lee, R.T.P., Samudra, G.S., Kwong, D.-L., Yeo, Y.-C. (2008). Novel rare-earth dielectric interlayers for wide NMOS work-function tunability in Ni-FUSI gates. IEEE Transactions on Electron Devices 55 (9) : 2370-2377. ScholarBank@NUS Repository. https://doi.org/10.1109/TED.2008.927391
dc.identifier.issn00189383
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82788
dc.description.abstractA novel method of forming rare-Earth (RE)-based interlayers to engineer the work function (φm) of nickel fully silicided (Ni-FUSI) gates was investigated. An extensive range of RE metals comprising yttrium (Y), erbium (Er), dysprosium (Dy), terbium (Tb), gadolinium (Gd), ytterbium (Yb), or lanthanum (La) were sputtered to form RE-based interlayers (REIL's) on SiO2 dielectric. The interposed REIL enabled Si conduction band-edge (Ec) modulation (∼3.8-4.0 eV) of midgap NiSi φm. Band edge φm was retained even after a high-temperature annealing was conducted before FUSI. Ni-FUSI gate φm was tunable to ∼4.11-4.39 and ∼4.25-4.48 eV by reducing the interlayer thickness and varying the Ni silicide phase, respectively. Improved gate leakage and breakdown voltage were observed for the REIL-incorporated gate stacks. RE-O-Si bonding confirmed that the REIL's that were formed on SiO2 were thin RE silicates. The modulation of Ni-FUSI gate φm was attributed to the presence of interfacial RE-oxygen (RE-O) dipoles and correlated well with the calculated RE-O dipole magnitude. The application of La-based interlayer LaIL in a HfO2 dielectric stack was also investigated, and band-edge NiSi φm could be engineered by intentionally inserting the LaIL at the HfO2/SiO2 interface. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TED.2008.927391
dc.sourceScopus
dc.subjectFully silicided (FUSI)
dc.subjectInterlayer
dc.subjectMetal gate
dc.subjectNiSi
dc.subjectRare-Earth (RE)
dc.subjectSilicate
dc.subjectWork function engineering
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/TED.2008.927391
dc.description.sourcetitleIEEE Transactions on Electron Devices
dc.description.volume55
dc.description.issue9
dc.description.page2370-2377
dc.description.codenIETDA
dc.identifier.isiut000258914000011
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