Please use this identifier to cite or link to this item: https://doi.org/10.1007/s00339-008-4674-0
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dc.titleLaser etching of glass substrates by 1064 nm laser irradiation
dc.contributor.authorHuang, Z.Q.
dc.contributor.authorHong, M.H.
dc.contributor.authorDo, T.B.M.
dc.contributor.authorLin, Q.Y.
dc.date.accessioned2014-10-07T04:31:22Z
dc.date.available2014-10-07T04:31:22Z
dc.date.issued2008-10
dc.identifier.citationHuang, Z.Q., Hong, M.H., Do, T.B.M., Lin, Q.Y. (2008-10). Laser etching of glass substrates by 1064 nm laser irradiation. Applied Physics A: Materials Science and Processing 93 (1) : 159-163. ScholarBank@NUS Repository. https://doi.org/10.1007/s00339-008-4674-0
dc.identifier.issn09478396
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82606
dc.description.abstractGlass substrates are transparent to 1064 nm laser irradiation and cannot be etched directly by 1064 nm pulsed laser. By placing the glass substrate in contact with copper sulphate (CuSO4) solution and irradiating 1064 nm laser light through the glass, etching of the glass is observed on the downside of the glass, the contact side with the copper sulphate solution. The etching mechanism is proposed to be a two-step process. The first step is the deposition of copper from copper sulphate solution upon 1064 nm irradiation. It is followed by the absorption of the 1064 nm laser irradiation by the deposited copper, resulting in the etching of the glass. Using this technique, 1 mm thick soda lime glass slides can be cut through. Furthermore, various arbitrary shapes can be diced out from glass substrates. The formation of copper deposits is observed and characterized. © 2008 Springer-Verlag.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1007/s00339-008-4674-0
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1007/s00339-008-4674-0
dc.description.sourcetitleApplied Physics A: Materials Science and Processing
dc.description.volume93
dc.description.issue1
dc.description.page159-163
dc.description.codenAPAMF
dc.identifier.isiut000258524000026
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