In 0.53Ga 0.47As n-channel metal-oxide-semiconductor field-effect transistors with shallow metallic source and drain extensions and offset N + Doped Regions for Leakage Suppression

Abstract

In this paper, we report the first demonstration of In 0.53Ga 0.47As n-channel metal-oxide-semiconductor field-effect transistors (n-MOSFETs) with a shallow metallic source/drain extension (SDE) and offset n + regions for leakage suppression. A SDE-last process flow was developed, i.e., the Ni-InGaAs metallic SDE was formed last, after formation of n + doped source/drain (S/D) regions. The n + S/D regions were offset from the gate edge with the use of sacrificial spacers. After spacer removal, self-aligned highly-abrupt Ni-InGaAs SDE was formed. Junction leakage between drain and body was effectively suppressed by ∼40 times by the n + S/D regions. © 2012 The Japan Society of Applied Physics.