Please use this identifier to cite or link to this item: https://doi.org/10.1109/LED.2007.907415
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dc.titleEffects of sulfur passivation on germanium MOS capacitors With HfON gate dielectric
dc.contributor.authorXie, R.
dc.contributor.authorZhu, C.
dc.date.accessioned2014-10-07T04:27:00Z
dc.date.available2014-10-07T04:27:00Z
dc.date.issued2007-11
dc.identifier.citationXie, R., Zhu, C. (2007-11). Effects of sulfur passivation on germanium MOS capacitors With HfON gate dielectric. IEEE Electron Device Letters 28 (11) : 976-979. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2007.907415
dc.identifier.issn07413106
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82237
dc.description.abstractIn this letter, we study the effects of sulfur (S) passivation, using aqueous ammonium sulfide ((NH4)2), on germanium (Ge) MOS capacitors with sputtered HfON as gate dielectric and TaN as metal-gate electrode. Compared with control samples, the S passivation can effectively reduce both equivalent oxide thickness and interface-state density. X-ray-photoelectron-spectroscopy analysis shows that (NH4)2S treatment can reduce the Ge-O bonds on Ge surface. The thermal stability of the S passivation under different postmetal-annealing temperatures was also examined, and it was found that samples with (NH4)2S treatment exhibit stable Ge/high-k interface upon 550-°C postmetal-deposition annealing, whereas interface quality degrades for those samples without S passivation. © 2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/LED.2007.907415
dc.sourceScopus
dc.subjectGermanium (Ge)
dc.subjectMOS capacitor
dc.subjectSulfur (S) passivation
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/LED.2007.907415
dc.description.sourcetitleIEEE Electron Device Letters
dc.description.volume28
dc.description.issue11
dc.description.page976-979
dc.description.codenEDLED
dc.identifier.isiut000250524200014
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