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Please use this identifier to cite or link to this item: https://doi.org/10.1109/20.538807
DC FieldValue
dc.titleMicrocracks of the thin-film head alumina: "l" cracks and "u" cracks
dc.contributor.authorChekanov, A.S.
dc.contributor.authorLow, T.S.
dc.contributor.authorAlli, S.
dc.contributor.authorKolosov, O.
dc.contributor.authorBriggs, A.
dc.date.accessioned2014-10-07T03:00:34Z
dc.date.available2014-10-07T03:00:34Z
dc.date.issued1996
dc.identifier.citationChekanov, A.S., Low, T.S., Alli, S., Kolosov, O., Briggs, A. (1996). Microcracks of the thin-film head alumina: "l" cracks and "u" cracks. IEEE Transactions on Magnetics 32 (5 PART 1) : 3696-3698. ScholarBank@NUS Repository. https://doi.org/10.1109/20.538807
dc.identifier.issn00189464
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/80719
dc.description.abstractTwo different types of microcracks in thin film head alumina were observed : cracks initiated at the alumina edges growing toward the head pole tips and cracks initiated at the head pole tip area and growing towards the leading edge of the alumina. Thermally induced cracks may cause degradation of magnetic head read/write performance due to the damage of the pole tip gap or corrosion of the head pole tips. Data from Ultrasonic AFM (UFM) indicate the difference in the subsurface structure of the observed cracks of the alumina. © 1996 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/20.538807
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.description.doi10.1109/20.538807
dc.description.sourcetitleIEEE Transactions on Magnetics
dc.description.volume32
dc.description.issue5 PART 1
dc.description.page3696-3698
dc.description.codenIEMGA
dc.identifier.isiutA1996VM25800108
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