Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2008.05.045
DC FieldValue
dc.titleCovalent integration of luminescent Eu (III) complex onto composite conductors or semiconducting substrates by grafting with organosilane
dc.contributor.authorDuan, Y.
dc.contributor.authorWen, G.-A.
dc.contributor.authorWei, W.
dc.contributor.authorFeng, J.-C.
dc.contributor.authorXu, G.-Q.
dc.contributor.authorHuang, W.
dc.date.accessioned2014-06-23T05:35:14Z
dc.date.available2014-06-23T05:35:14Z
dc.date.issued2008-11-28
dc.identifier.citationDuan, Y., Wen, G.-A., Wei, W., Feng, J.-C., Xu, G.-Q., Huang, W. (2008-11-28). Covalent integration of luminescent Eu (III) complex onto composite conductors or semiconducting substrates by grafting with organosilane. Thin Solid Films 517 (2) : 469-473. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2008.05.045
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/75834
dc.description.abstractA method to introduce the luminescent rare earth complex onto Si and indium tin oxide substrates by grafting with organosilane was presented. The organosilane, 3-aminopropyltriethoxysilane, was used as molecular bridge to link 5-(7-bromoheptyl)-5′-methyl-2,2′-bipyridine to the activated substrates. Europium complex, Europium tris(2-thenoyltrifluoroacetonato)(2,2′-bipyridine), was then incorporated to the substrates via coordination reaction. The surface chemical composition and surface morphology of modified substrates were investigated by X-ray photoelectron spectroscopy and atomic force microscopy, respectively. The electrochemical characterization, fluorescence microscopy and photoluminescence analysis were utilized to confirm the Europium complex formation on the substrates. © 2008 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2008.05.045
dc.sourceScopus
dc.subjectEuropium complex
dc.subjectOrganosilane
dc.subjectSubstrate
dc.subjectSurface functionalization
dc.typeArticle
dc.contributor.departmentCHEMISTRY
dc.description.doi10.1016/j.tsf.2008.05.045
dc.description.sourcetitleThin Solid Films
dc.description.volume517
dc.description.issue2
dc.description.page469-473
dc.description.codenTHSFA
dc.identifier.isiut000261693900001
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