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Title: FePt films fabricated by electrodeposition
Authors: Thongmee, S. 
Ding, J. 
Lin, J.Y. 
Blackwood, D.J. 
Yi, J.B. 
Yin, J.H.
Issue Date: 2007
Citation: Thongmee, S., Ding, J., Lin, J.Y., Blackwood, D.J., Yi, J.B., Yin, J.H. (2007). FePt films fabricated by electrodeposition. Journal of Applied Physics 101 (9) : -. ScholarBank@NUS Repository.
Abstract: In this work, we have fabricated FePt films with a thickness in the range of 0.1-1 μm using the combination of electrodeposition and postannealing. FePt films with a composition around Fe50 Pt50 were formed by electrodeposition onto the Si (100) substrates with an underlayer of Au, Ag, or Cu, and subsequently annealed at a temperature in the range of 200-900 °C for 20 min. From our x-ray diffraction analysis, the L 10 FePt phase started to form after annealing at 400 °C for the film deposited on the Au underlayer. The highest coercivity (10 kOe) was found after annealing at 600 °C. When the FePt was deposited on the Ag underlayer, a high coercivity over 15 kOe with an out-of-plane anisotropy has been achieved after annealing at 700-800 °C. The magnetic anisotropy was associated with the crystallographic texture. The magnetic properties of FePt films deposited on the Cu underlayer were relatively poor with lower values of coercivity (4-5 kOe as the maximum coercivity), probably due to the large grain size. © 2007 American Institute of Physics.
Source Title: Journal of Applied Physics
ISSN: 00218979
DOI: 10.1063/1.2711810
Appears in Collections:Staff Publications

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