Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2005.09.054
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dc.titleVapor pressure and voiding effects on thin film damage
dc.contributor.authorChew, H.B.
dc.contributor.authorGuo, T.F.
dc.contributor.authorCheng, L.
dc.date.accessioned2014-06-19T05:41:54Z
dc.date.available2014-06-19T05:41:54Z
dc.date.issued2006-05-10
dc.identifier.citationChew, H.B., Guo, T.F., Cheng, L. (2006-05-10). Vapor pressure and voiding effects on thin film damage. Thin Solid Films 504 (1-2) : 325-330. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.054
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73999
dc.description.abstractPlastic encapsulated microcircuits exposed to a humid environment are susceptible to thin film adhesive failures during reflow soldering. Recent computational studies on thin film adhesive failures have adopted void-containing cell elements based on an extended Gurson continuum constitutive model. Such an approach falls short of accurately replicating the ductile fracture process, particularly in cases where the film exhibits large elastic strains (e.g. polymeric materials). An alternative approach using discrete voids is capable of accurately resolving the growth and interactions of voids. In this work, thin film adhesive failures are studied using a model problem of a ductile adhesive joining two elastic substrates. The adhesive contains a centerline crack. Damage in the adhesive is confined to a single row of discrete voids ahead of the crack-tip. Under vapor pressure assisted voiding, large-scale adhesive damage is observed. Adhesive damage is further aggravated by the presence of large oblate voids. Our study offers some evidence of vapor pressure assisted void growth and coalescence as a key mechanism of popcorn cracking in IC packages. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2005.09.054
dc.sourceScopus
dc.subjectDiscrete voids
dc.subjectThin film
dc.subjectVapor pressure
dc.subjectVoid shape
dc.typeConference Paper
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.tsf.2005.09.054
dc.description.sourcetitleThin Solid Films
dc.description.volume504
dc.description.issue1-2
dc.description.page325-330
dc.description.codenTHSFA
dc.identifier.isiut000236486200076
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