Two masks process for high aspect ratio inertial sensors with ajustable range

Abstract

A two-mask process technology is proposed to fabricate silicon capacitive inertial sensors using comb drive structures. A conductive silicon wafer is anodically bonded on Pyrex glass substrate. The high aspect ratio silicon accelerometer structure was micromachined using DRIE and released from the glass substrate by further DRIE due to its notching effect. The spring stiffness was adjusted with another DRIE process. In this way, inertial sensors with different range can be process using same masks only by changing the spring stiffness. © 2004 IEEE.