Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2008.4763490
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dc.titleOptimization of the thermal performance of microchannel heat sinks using thermally developing nusselt number correlation
dc.contributor.authorLee, P.S.
dc.contributor.authorChou, S.K.
dc.contributor.authorLee, Y.J.
dc.date.accessioned2014-06-19T05:38:42Z
dc.date.available2014-06-19T05:38:42Z
dc.date.issued2008
dc.identifier.citationLee, P.S., Chou, S.K., Lee, Y.J. (2008). Optimization of the thermal performance of microchannel heat sinks using thermally developing nusselt number correlation. 10th Electronics Packaging Technology Conference, EPTC 2008 : 545-551. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2008.4763490
dc.identifier.isbn9781424421183
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73732
dc.description.abstractOne-dimensional (1-D) thermal resistance model has been shown in various works to be a computationally economical alternative to the full three-dimensional (3-D) conjugate heat transfer analysis achievable by computational fluid dynamics (CFD) codes for evaluating the thermal performance of microchannel heat sinks. This simplified 1-D approach is often exploited to obtain the optimum microchannel geometry that would give rise to the best thermal performance under certain constraint such as constant flow rate, pressure drop or pumping power. The thermal resistance model essentially consists of the following three thermal resistive components: conductive, convective and caloric. In evaluating the convective thermal resistance, fully developed Nusselt number correlations were often used. However, the small length scale of microchannels and the fact that liquid coolant with high Prandtl number is often used as the working fluid means that the flow encountered in microchannel heat sinks is typically thermally developing rather than fully developed. The present work utilizes a recently proposed Nusselt number correlation that was specifically developed for rectangular channels of various aspect ratios to evaluate the convective thermal resistance. Comparison shows that the optimized microchannel geometry obtained using the more appropriate thermally developing Nusselt number correlation is different from that obtained using a fully developed Nusselt number correlation. In fact, the discrepancy in the channel width can be as large as 30% for the range of constant pressure drop constraint examined. With the same pressure drop, the optimized microchannel width determined using the thermally developing Nusselt correlation is larger, which will induce more flow (due to the associated lower flow resistance) into the microchannel leading to increased convective heat transfer and reduced overall thermal resistance, i.e. improved heat transfer performance. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2008.4763490
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/EPTC.2008.4763490
dc.description.sourcetitle10th Electronics Packaging Technology Conference, EPTC 2008
dc.description.page545-551
dc.identifier.isiut000265818600087
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