Please use this identifier to cite or link to this item:
https://doi.org/10.1109/EPTC.2006.342774
| DC Field | Value | |
|---|---|---|
| dc.title | Nanoindentation study of sputtered Al-Cu thin films for interconnect applications | |
| dc.contributor.author | Kumar, A. | |
| dc.contributor.author | Jayaganthan, R. | |
| dc.contributor.author | Chandra, R. | |
| dc.contributor.author | Chawla, V. | |
| dc.contributor.author | Tay, A.A.O. | |
| dc.date.accessioned | 2014-06-19T05:37:52Z | |
| dc.date.available | 2014-06-19T05:37:52Z | |
| dc.date.issued | 2006 | |
| dc.identifier.citation | Kumar, A.,Jayaganthan, R.,Chandra, R.,Chawla, V.,Tay, A.A.O. (2006). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 560-564. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342774" target="_blank">https://doi.org/10.1109/EPTC.2006.342774</a> | |
| dc.identifier.isbn | 142440665X | |
| dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/73664 | |
| dc.description.abstract | Al-Cu thin films were deposited by DC-magnetron sputtering. The formation of different phases and microstructures of Al-Cu thin films were characterised by using XRD and AFM technqiues. The mechanical properties of the Al-Cu thin films were measured by CSEM Nanoindentation technique. It was found that the higher hardness and Young modulus of Al-Cu thin films is due to presence of precipitate and ductile phases in the film. The nanosized grain morphology improves the strength of Al-Cu thin film significantly. © 2006 IEEE. | |
| dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2006.342774 | |
| dc.source | Scopus | |
| dc.type | Conference Paper | |
| dc.contributor.department | MECHANICAL ENGINEERING | |
| dc.description.doi | 10.1109/EPTC.2006.342774 | |
| dc.description.sourcetitle | Proceedings of the Electronic Packaging Technology Conference, EPTC | |
| dc.description.page | 560-564 | |
| dc.identifier.isiut | NOT_IN_WOS | |
| Appears in Collections: | Staff Publications | |
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