Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/73434
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dc.titleEnhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
dc.contributor.authorAlam, M.E.
dc.contributor.authorGupta, M.
dc.date.accessioned2014-06-19T05:35:04Z
dc.date.available2014-06-19T05:35:04Z
dc.date.issued2009
dc.identifier.citationAlam, M.E.,Gupta, M. (2009). Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion. TMS Annual Meeting : 661-668. ScholarBank@NUS Repository.
dc.identifier.isbn9780873397353
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73434
dc.description.abstractIn the present study, 1.1 volume percent of nano size copper was incorporated into pure tin using hybrid microwave sintering assisted powder metallurgy route. Microwave sintered samples were extruded both at room temperature and at 230 °C. Microstructural characterization studies were conducted on the extruded samples to investigate the distribution characteristics of secondary phase and grain morphology. Room temperature tensile test results revealed that hot extruded Sn-Cu samples exhibited higher strengths (~ 41%, in case of 0.2% yield strength and ~ 38%, in case of ultimate tensile strength) and ductility (~ 15%) when compared to room temperature extruded samples. On the contrary, the tensile properties of pure tin remained independent of extrusion temperature. An attempt is made in this study to correlate the effect of extrusion temperature on the microstructural evolution and tensile properties of Sn-Cu solder.
dc.sourceScopus
dc.subjectExtrusion temperature
dc.subjectPowder metallurgy
dc.subjectTensile properties.
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleTMS Annual Meeting
dc.description.page661-668
dc.description.coden85MVA
dc.identifier.isiutNOT_IN_WOS
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