Please use this identifier to cite or link to this item:
DC FieldValue
dc.titleEnhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
dc.contributor.authorAlam, M.E.
dc.contributor.authorGupta, M.
dc.identifier.citationAlam, M.E.,Gupta, M. (2009). Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion. TMS Annual Meeting : 661-668. ScholarBank@NUS Repository.
dc.description.abstractIn the present study, 1.1 volume percent of nano size copper was incorporated into pure tin using hybrid microwave sintering assisted powder metallurgy route. Microwave sintered samples were extruded both at room temperature and at 230 °C. Microstructural characterization studies were conducted on the extruded samples to investigate the distribution characteristics of secondary phase and grain morphology. Room temperature tensile test results revealed that hot extruded Sn-Cu samples exhibited higher strengths (~ 41%, in case of 0.2% yield strength and ~ 38%, in case of ultimate tensile strength) and ductility (~ 15%) when compared to room temperature extruded samples. On the contrary, the tensile properties of pure tin remained independent of extrusion temperature. An attempt is made in this study to correlate the effect of extrusion temperature on the microstructural evolution and tensile properties of Sn-Cu solder.
dc.subjectExtrusion temperature
dc.subjectPowder metallurgy
dc.subjectTensile properties.
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleTMS Annual Meeting
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

Page view(s)

checked on May 21, 2019

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.