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Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/73433
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dc.titleEnhancing mechanical response of a 96.5Sn-3.0Ag-0.5Cu solder using energy efficient microwave assisted sintering route
dc.contributor.authorNai, S.M.L.
dc.contributor.authorKuma, J.V.M.
dc.contributor.authorGupta, M.
dc.date.accessioned2014-06-19T05:35:04Z
dc.date.available2014-06-19T05:35:04Z
dc.date.issued2009
dc.identifier.citationNai, S.M.L.,Kuma, J.V.M.,Gupta, M. (2009). Enhancing mechanical response of a 96.5Sn-3.0Ag-0.5Cu solder using energy efficient microwave assisted sintering route. The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III 2 : 1052-1057. ScholarBank@NUS Repository.
dc.identifier.isbn9781615674237
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73433
dc.description.abstractIn the present study, the effects of conventional sintering and two-directional microwave assisted rapid sintering on the microstructure and tensile properties of a commercial lead-free solder (96.5Sn-3.0Ag-0.5Cu) are investigated. Conventional sintering was conducted on solder samples in an inert Argon atmosphere, whilst microwave sintering was carried out on the samples under ambient conditions. Two sintering temperatures of 150°C and 210°C were investigated. Microwave sintered samples exhibited lower porosity and more refined matrix grain size. Tensile results of microwave sintered samples also revealed superior strength (0.2% YS and UTS) when compared to conventionally sintered samples. Furthermore, results showed that samples microwave sintered at 210°C yielded the best combination of mechanical properties.
dc.sourceScopus
dc.subjectLead-free solder
dc.subjectMicrowave sintering
dc.subjectPowder metallurgy
dc.subjectTensile properties
dc.typeConference Paper
dc.contributor.departmentCIVIL ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleThe Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III
dc.description.volume2
dc.description.page1052-1057
dc.identifier.isiutNOT_IN_WOS
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