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Title: Adhesive wafer-to-wafer bonding using contact imprinting
Authors: Yu, L. 
Pang, A.J.
Chen, B.
Tay, F.E.H. 
Iliescu, C.
Keywords: Adhesive bonding
Contact imprinting
SU-8 photoresist
Wafer-to-wafer bonding
Issue Date: 2007
Citation: Yu, L., Pang, A.J., Chen, B., Tay, F.E.H., Iliescu, C. (2007). Adhesive wafer-to-wafer bonding using contact imprinting. Proceedings of SPIE - The International Society for Optical Engineering 6415 : -. ScholarBank@NUS Repository.
Abstract: The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200° C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
ISBN: 0819465232
ISSN: 0277786X
DOI: 10.1117/12.696544
Appears in Collections:Staff Publications

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