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|Title:||Adhesive wafer-to-wafer bonding using contact imprinting||Authors:||Yu, L.
|Issue Date:||2007||Citation:||Yu, L., Pang, A.J., Chen, B., Tay, F.E.H., Iliescu, C. (2007). Adhesive wafer-to-wafer bonding using contact imprinting. Proceedings of SPIE - The International Society for Optical Engineering 6415 : -. ScholarBank@NUS Repository. https://doi.org/10.1117/12.696544||Abstract:||The present work proposes an adhesive bonding technique, at wafer level, using SU-8 negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, or from a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 100°C and 200° C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield: 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device.||Source Title:||Proceedings of SPIE - The International Society for Optical Engineering||URI:||http://scholarbank.nus.edu.sg/handle/10635/73133||ISBN:||0819465232||ISSN:||0277786X||DOI:||10.1117/12.696544|
|Appears in Collections:||Staff Publications|
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