A new fabrication process of silicon nanotips - NERCOM

Abstract

This paper presents a new fabrication process for nanotips array using notching effect of reflected charges on mask (NERCOM). The NERCOM fabrication process is based on two phenomena: flowing of thick photoresist mask after 'bake and the notching effect of the reflected charges from the photoresist mask in a plasma etching process. Heating the photoresist at different temperature and time will generate different profile of the masking layer walls. During the plasma etching process, the charges (ions and radicals) are reflected by the oblique profile of the masking layer walls and generate an undercut. This phenomenon is utilized with an isotropic etching process in a Deep RIE system to produce tips. Due to the isotropy of the process, the tips are generated. The results indicate that the radii of the tips are in the range of 40 to 60 nm.